![]() Two types of interconnect structures are mainly used in order to propagate signals in integrated circuits (ICs) and printed circuit boards (PCBs): microstripline and stripline. Nevertheless, high-speed characterization modeling efforts do not often take into account the variations in conductor losses due to copper foil roughness or treatments made to the copper foil to promote adhesion. Many articles have shown in detail the characterization and modeling efforts related to the impact of dielectric loss in PCBs and the differences between various dielectric materials 1. ![]() In high speed digital interconnects, signal attenuation is a result of both dielectric losses and conductor losses. Stripline models can be used to determine the impact of copper surface roughness on transmission properties. ![]() Then a Deal Was Forged.Ī decade in, was IPC-2581 worth the effort? Regarding the Use of Core Vias in a PCB Designīuried and blind vias solve most HDI routing studies.Ī new study reveals emerging applications for attaching very-fine-pitch parts using low-temp methods.ĭata Exchange Was Dead. From proper grounding to material selection, common best practices for optimal RF results.Ĭritical Success Factors for Implementing and Sustaining Quality Management Systemsĭoes sustained ISO 9001 and Lean Six Sigma deliver success? ![]()
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